Blog

Welcome to our new Instron Community Blog hosted by Instron. It is a compilation of the freshest, brightest, most-talented minds that Instron has to offer. The world of materials science is so vast and encompasses the broadest range of industries, materials, and challenges that no one person can possibly possess all the knowledge required to be the resident expert – or master of materials science. It takes a small army behind the scenes collaborating and sharing technical know-how, experiences, and ideas to present the most accurate, relevant, and timely information to you – our readers. 

We invite you to tell us who you are, share your stories and talk about your experiences. Join the Instron Community. 



What Does "Touch-friendly" Software Actually Mean?

The progressive outcome of Bluehill® Universal took a consolidated effort from Instron experts, bringing together unrivaled experience and cutting-edge research. The user experience has been designed by a collaboration of members from different software teams across the world, each team representing various software products offered by Instron. This consortium has worked closely together to create a Bluehill application style that can be translated across all of Instron’s software products.

Posted On Apr 13, 2017 04:18 PM

Micro Three-Point Bend Testing for Microelectronics

Reliability analysis of electronic packages and components is a critical step in microelectronics, as these packages are widely used in portable devices such as smartphones, tablets, laptops, etc. Studying electrical performance may not be enough, as a package’s mechanical characterization can directly or indirectly impact reliability of a finished product. Three-point bend tests are performed to understand the strength of chip packages, such as chip-on-film (COF), integrated circuits (IC), and ball grid arrays (BGAs).

Posted By Rajiv Iyer OnApr 03, 2017 03:33 PM