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The progressive outcome of Bluehill® Universal took a consolidated effort from Instron experts, bringing together unrivaled experience and cutting-edge research. The user experience has been designed by a collaboration of members from different software teams across the world, each team representing various software products offered by Instron. This consortium has worked closely together to create a Bluehill application style that can be translated across all of Instron’s software products.
Apr 13, 2017 04:18 PM
Reliability analysis of electronic packages and components is a critical step in microelectronics, as these packages are widely used in portable devices such as smartphones, tablets, laptops, etc. Studying electrical performance may not be enough, as a package’s mechanical characterization can directly or indirectly impact reliability of a finished product. Three-point bend tests are performed to understand the strength of chip packages, such as chip-on-film (COF), integrated circuits (IC), and ball grid arrays (BGAs).
Rajiv Iyer OnApr 03, 2017 03:33 PM