A tensile test is performed on solder pins until failure as part of the mechanical tests on printed circuit boards for the electronics market.
Test for measuring strength of lead frames bonded on the substrate and understanding the breaking point of lead frames between the die and substrate.
Test used for characterization of adhesives in electronics assembly. Mainly used for measuring the strength of adhesive at the joint.
Test for pulling integrated circuit packages and other components from the PCB. Used for bond characterization between the die and the substrate.